Publications‎ > ‎

International Journal Papers (2000-2009)

2009:
1. L.Chen, K.B.Yeap, K.Y.Zeng, and G.R.Liu
    Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation",
    Philosophical Magazine, 89, no.17, (2009): 1395-1413. http://dx.doi.org/10.1080/14786430902973858
2. K.B.Yeap, K.Y.Zeng and D.Z.Chi
    Wedge Indentation Studies of Low-k Films at Inert, Water and Ambient Environments
    Materials Science and Engineering A, 518 (2009): 132-138http://dx.doi.org/10.1016/j.msea.2009.04.030
3. X.X.Zhang, K.Y.Zeng, J.Li and Y.W.Zhang
    Instability pathways of curved hydrogel thin shells under concentrated loadings
    Journal of Applied Physics, 106 (2009): 023536http://dx.doi.org/10.1063/1.3186045
4. C.M.She, Y.W.Zhang and K.Y.Zeng
    A three-dimensional finite element analysis of interface delamination in a ductile film/hard substrate system induced by wedge indentation
    Engineering Fracture Mechanics, 76 (2009): 2272-2280http://dx.doi.org/10.1016/j.engfracmech.2009.07.016


2008:
1.   Zeng,K, Y.L.Ng, L.Shen, K.K.Rajan and L.C.Lim
    Deformation and Fracture Behaviors of [011]‑poled Pb (Zn1/3Nb2/3)O3‑7%PbTiO3 Single Crystals
    MATERIALS SCIENCE AND ENGINEERING A‑ STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 498,
    no.1‑2 (2008): 457‑463. http://dx.doi.org/10.1016/j.msea.2008.08.034
2. Wong,M.F., and K.Zeng
    Deformation Behavior of PZN‑6%PT Single Crystal during Nanoindentation
    PHILOSOPHICAL MAGAZINE, 88, no. 26 (2008): 3105‑3128. http://dx.doi.org/10.1080/14786430802524330
3. Wong,M.F., X.Heng and K. Zeng
    Domain Characterization of Pb(Zn1/3Nb2/3)O3‑(6‑7%)PbTiO3 Single Crystals using Scanning Electron Acoustic Microscopy
    JOURNAL OF APPLIED PHYSICS, 104 (2008): 074103. http://dx.doi.org/10.1063/1.2988179
4. Wu,W., C.Y.Zhang, Y.W.Zhang, K.Zeng and Y. Li
    Stress gradient enhanced plasticity in a monolithic bulk metallic glass
    INTERMETALLICS, 16 (2008): 1190‑1198. http://dx.doi.org/10.1016/j.intermet.2008.07.004
5. Yeap,K.B., K.Zeng and D.Z.Chi
    Determining the Interfacial Toughness of low‑k films on Si Substrate by Wedge Indentation: Further Studies
    ACTA MATERIALIA, 56, no.5 (2008): 977‑984. http://dx.doi.org/10.1016/j.actamat.2007.10.051
6. Zeng,K, Y.S.Pang, L.Shen, K.K.Rajan and L.C.Lim
    Elastic modulus, hardness and fracture behavior of Pb(Zn1/3Nb2/3)O3‑PbTiO3 single crystal
    MATERIALS SCIENCE AND ENGINEERING A‑STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 472,
    no.1‑2 (2008): 35‑42. http://dx.doi.org/10.1016/j.msea.2007.03.008


2007:
1. Yeap, K.B., K.Zeng, H.Y.Jiang, L.Shen and D.Z.Chi
    Determining interfacial properties of submicron low‑k films on Si substrate by using wedge indentation technique
   JOURNAL OF APPLIED PHYSICS, 101, part.123531 (2007). http://dx.doi.org/10.1063/1.2749473
2. Liu,P., Y.W.Zhang, K.Zeng, C.Lu and K.Y.Lam
    Finite element analysis of interface delamination and buckling in thin film systems by wedge indentation
    ENGINEERING FRACTURE MECHANICS, 74, no.7 (2007): 1118-1125. http://dx.doi.org/10.1016/j.engfracmech.2006.12.025
3. Peng,H.G., D.Z.Chi, W.D.Wang, J.H.Li, K.Zeng, R.S.Vallery, W.E.Frieze, M.A.Skalsey, D.W.Gidley and A.F.Yee
    Pore Sealing by NH3 Plasma Treatment of Porous Low Dielectric Constant Films
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 154, no.4 (2007): 85‑94. http://dx.doi.org/10.1149/1.2435625
 
 
2006:
1.   Zhang, C.Y., Y.W.Zhang, K.Zeng, L.Shen and Y.Y.Wang, "Extracting the elastic and viscoelastic properties of a
      polymeric film using a sharp indentation relaxation test".  JOURNAL OF MATERIALS RESEARCH, 21, no.12
      (2006): 2991‑3000.
2.   Zhang,C.Y., Y.W.Zhang*, K Zeng and L Shen, "Characterization of mechanical properties of polymers by
      indentation tests". PHILOSOPHICAL MAGAZINE, 86, no.28 (2006): 4487‑4506.
3.   Chen,W., H.Gong and K.Zeng, "Mechanical properties of Cu‑Al‑O thin films prepared by plasma‑enhanced
      chemical vapor deposition".  JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 24, no.3 (2006):
      537‑541.
4.   Kumar, K.M., A.Kripesh, L.Shen, K.Zeng and A.A.O.Tay, "Nanoindentation study of Zn‑based Pb free solders
      used in fine pitch interconnect applications".  MATERIALS SCIENCE AND ENGINEERING A‑STRUCTURAL
      MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 423, no.1‑2 (2006): 57‑63.

 
2005:
1.   Tang,C.G., Y.Li and K.Zeng, "Effect of residual shear bands on serrated flow in a metallic glass". MATERIALS
      LETTERS, 59, no.26 (2005): 3325‑3329.
2.   Ee,Y.C, Z.Chen, L.Chan, K.H.See, S.B.Law, S.Xu, Z.L.Tsakadze, L.Rutkevych, K.Zeng and L.Shen, "Formation
      of Ti‑Si‑N film using low frequency, high density inductively coupled plasma process".  JOURNAL OF VACUUM
      SCIENCE & TECHNOLOGY B, 23, no.6 (2005): 2444‑2448.
3.   Sani,R.B.M, S.K.Sinha, J.P.Y.Tan and K.Zeng, "Wear debris generation mechanism for polymers studied using
      nano‑scratching technique". PHILOSOPHICAL MAGAZINE A ‑ PHYSICS OF CONDENSED MATTER
     STRUCTURE DEFECTS, 85, no.19 (2005): 2101‑2122.
4.   Swaddiwudhipong,S., K.K.Tho, Z.S.Liu and K.Zeng, "Materials Characterization based on dual indenters."
      INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 42 (2005): 69‑83.
5.   Widodo,J., L.N.Goh, W.Lu, S.G.Mhaisalkar, K.Zeng and L.C.Hsia, "Comparative study of trimethyl silane and
      tetramethylcyclotetrasiloxane‑based low‑k films". JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 152,
      no.4 (2005): G246‑G251.
6.   Damayanti,M., J.Widodo, T.Sritharan, S.G.Mhaisalkar, W.Lu, Z.H.Gan, K.Zeng and L.C. Hsia, "Adhesion study of
      low‑k/Si system using 4‑point bending and nanoscratch test".  MATERIALS SCIENCE AND ENGINEERING
     B‑SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 121 (2005): 193‑198.
7.    Swaddiwudhipong,S., K.K.Tho, Z.S.Liu and K.Zeng, "Material Characterization based on Instrumented
      Indentation". JOURNAL OF METASTABLE AND NANOCRYSTALLINE MATERIALS, 23 (2005): 359‑362.
8.   Widodo,J., W.Lu, S.G.Mhaisalkar, J.L.Sudijono, L.C.Hsia, L.Shen and K.Zeng, "Effects of CO2 and O2 on the
      property of tetra methyl tetra cyclo siloxanes based low‑k film". THIN SOLID FILMS, 472 (2005):195‑202.
9.   Huang,J.C., P.C.Lim, L.Shen, P.K.Pallathadka, K.Zeng and C.B.He, "Cubic Silsesquioxane‑Polyimide
      Nanocomposites with Improved Thermomechanical and Dielectric Properties". ACTA MATERIALIA, 53, no.8
      (2005): 2395‑2404.
10. Widodo,J., M.Damayanti, S.G.Mhaisajkar, W.Lu, S.Ong, T.Sritharan, K.Zeng and L.C.Hsia, "Adhesion study of
      tetra methyl cyclo tetra siloxanes (TMCTS) and tri methyl silane (3MS)‑based low‑k films". MICROELECTRONIC
      ENGINEERING, 81 (2005): 35‑43.
11.  Zhang, C.Y., Y.W.Zhang, K.Zeng and L.Shen, "Nanoindentation of polymers with a sharp indenter".  JOURNAL
      OF MATERIALS RESEARCH, 20, no.6 (2005): 1597‑1605.
12.  Zeng,K., Z.K.Chen, L.Shen and B.Liu, "Study of mechanical properties of light‑emitting polymer films by
       nanoindentation technique".  THIN SOLID FILMS, 477 (2005): 111‑118.
13.  Nai,M.H., C.T.Lim, K.Zeng and V.B.C.Tan, "Nanoindentation study of polymer based nanocomposites".
       JOURNAL OF METASTABLE AND NANOCRYSTALLINE MATERIALS, 23 (2005): 363‑366.
14.  Tho,K.K., S.Swaddiwudhipong, Z.S.Liu and K.Zeng, "Simulation of instrumented indentation and material
       characterization". MATERIALS SCIENCE AND ENGINEERING A‑STRUCTURAL MATERIALS
       PROPERTIES MICROSTRUCTURE AND PROCESSING,  390, no.1‑2 (2005): 202‑209.

 
2004:
1.   Tang,C.G., Y.Li and K.Zeng, "Characterization of mechanical properties of a Zr‑based metallic glass by indentation
      techniques". MATERIALS SCIENCE AND ENGINEERING A‑STRUCTURAL MATERIALS PROPERTIES
      MICROSTRUCTURE AND PROCESSING,  384 (2004): 215‑223.
2.   Wong, B.K.P.W., S.K.Sinha, J.P.Y.Tan and K.Zeng, "Nano‑wear mechanism for ultra‑high molecular weight
      polyethylene (UHMWPE) sliding against a model hard asperity".  TRIBOLOGY LETTERS, 17, no.3 (2004):
      613‑622.
3.   Shah,M., K.Zeng and A.A.O.Tay, "Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds using
      Nanoindentation". JOURNAL OF ELECTRONIC PACKAGING, 126, no.3 (2004 2004): 87‑093.
4.   Shen, L., I.Y.Phang, T.X.Liu and K.Zeng, "Nanoindentation and morphological studies on nylon 66/organoclay
       nanocomposites. II. Effect of strain rate".  POLYMER, 45 (2004): 8221‑8229.
5.   Tho,K.K., S.Swaddiwudhipong, Z.S.Liu, and K Zeng, "Uniqueness of reverse analysis from conical indentation
       tests." JOURNAL OF MATERIALS RESEARCH, 19, no.8 (2004): 2498‑2502.
6.   Zhang,C.Y., Y.W.Zhang and K.Zeng, "Extracting the mechanical properties of a viscoelastic polymeric film on a hard
      elastic substrate."  JOURNAL OF MATERIALS RESEARCH, 19, no.10 (2004): 3053‑3061.
7.   Yang,S, Y.W.Zhang and K.Zeng, "Analysis of nanoindentation creep for polymeric materials." JOURNAL OF
       APPLIED PHYSICS, 95, no.7 (2004): 3655‑3666.
8.   Ee,Y.C., Z.Chen, L.Chan, A.K.H.See, S.B.Law, K.C.Tee, K.Zeng and L.Shen, "Effect of processing parameters on
      electroless Cu seed layer properties". THIN SOLID FILMS, 462‑463 (2004): 197‑201.
9.   Wang,Y.H., M.R.Moitreyee, R.Kumar, S.Y.Wu, J.L.Xie, P.Yew, B.Subramanian, L.Shen and K.Zeng, "The
       mechanical properties of ultra‑low‑dieletric‑constant films". THIN SOLID FILMS, 462‑463 (2004): 227‑230.
10.  Widodo,J., W.Lu, S.G.Mhaisalkar, L.C.Hsia, J.P.Y.Tan, L.Shen and K.Zeng, "Characterization of tetra methyl
       cyclo tetra siloxanes‑based low‑k dielectric film". THIN SOLID FILMS, 462‑463 (2004): 213‑218.
11.  Widodo,J, L.N.Goh, W.Lu, S.G.Mhaisalkar, S.Ong, J.L.Sudijono, L.C.Hsia, J.P.Y.Tan and K.Zeng, "Effects of
       O2 and He on the properties of the trimethyl silane based low‑k films".  JOURNAL OF VACUUM SCIENCE &
      TECHNOLOGY B, 22, no.3 (2004): 1030‑1036.
12.  Wang,Y.H., M.R.Moitreyee, R.Kumar, L.Shen, K.Zeng, J.W.Chai and J.S.Pan, "A comparative study of low
       dielectric constant barrier layer, etch stop and hardmask films of hydrogenated amorphous Si‑(C,O,N)". THIN
       SOLID FILMS, 460 (2004): 211‑216. 
13.  Shen,L., I.Y.Phang, L.Chen, T.X.Liu and K.Zeng, "Nanoindentation and morphological studies on nylon
       nanocomposites I. Effect of clay loading".  POLYMER, 45 (2004): 3341‑3349.
14.  Wong,J.S.S., H.‑J.Sue, K.Zeng, R.K.. Li and Y.‑M.Mai, "Scratch damage of polymers in nanoscale". Acta
       Materialia, 52 (2004): 431‑443.
15.   Shen,L., and K.Zeng, "Comparison of mechanical properties of porous and non‑porous low‑k dielectric films".
       MICROELECTRONIC ENGINEERING, 71 (2004): 221‑228.

 
2003:
1.   Logeeswaran,V.J., M.L.Chan, E.H.Tay, K.Zeng, L.Shen and F.S.Chau, "Experimental determineation of
      micromachined discrete and continuous device spring constant using nanoindentation method".  ANALOG
      INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 37, no.10 (2003): 45‑56.
2.   Zeng,K., F.‑R.Zhu, J.Q.Hu, L.Shen, K.Zhang and H.Gong, "Investigation of mechanical properties of transparent
      conducting oxide thin films". THIN SOLID FILMS, 443 (2003): 60‑65.
3.   Shen,L., K.Zeng, Y.‑H.Wang, B.Narayanan and R.Kumar, "Determination of the hardness and elastic modulus of
      low‑k thin films and their barrier layer for microelectronic applications". MICROELECTRONIC ENGINEERING,
      70 (2003): 115‑124.
4.   Liu,T.X., Z.H.Liu, K.X.Ma, L.Shen, K.Zeng and C.B.He, "Morphology, thermal and mechanical behavior of
      polyamide 6/layered‑silicate nanocomposites". COMPOSITES SCIENCE AND TECHNOLOGY, 63 (2003):
      331‑337.

 
2002:
1.   Qu, X.X., Q.X. Zhang, Q.B. Zou, N Balasubramanian, P Yang and K Zeng, "Characteization of TiAl alloy films for
      potential application in MEMS bimorph actuators".  MATERIALS SCIENCE IN SEMICONDUCTOR
      PROCESSING, 5 (2002): 35‑38.
2.   Zeng,K. and L.Shen, "A new analysis of nanoindentation load‑displacement curves".  PHILOSOPHICAL
      MAGAZINE A ‑ PHYSICS OF CONDENSED MATTER STRUCTURE DEFECTS, 82, no.10  (2002):
      2223‑2229.

 
2001:
1.   A.U.J.Yap, S.H.L.Tan, S.S.C.Wee, E.L.C.Lim, and K.Zeng,  "Chemical Degradation of Composite Restoratives".
     JOURNAL OF ORAL REHABILITATION, 28 (2001): 1015‑1021.
2.   Zeng, K., and C.‑H.Chiu, "An Analysis of Load‑Penetration Curves from Instrumented Indentation."  ACTA
      MATERIALIA, 49 (2001): 3539‑3551.
3.   Zhang,Y.W., K.Zeng and R.Thampurun, "Interface delamination generated by indentation in thin film systems ‑ a
      computational mechanics study". MATERIALS SCIENCE AND ENGINEERING A‑STRUCTURAL MATERIALS
      PROPERTIES MICROSTRUCTURE AND PROCESSING, 319‑321 (2001): 893‑897.

 
2000:
1.   Chia,S.M., K.W.Leong, J.Li, X.Xu, K.Zeng, P.N. Er, S.J.Gao and H.Yu, "Hepatocyte Encapsulation for Enhanced
      Cellular Functions." TISSUE ENGINEERING, 6, no.5 (2000): 481‑495.
2.   Gouldstone,A., H.‑J.Koh, K.Zeng, A.E.Giannakopoulos and S.Suresh, "Discrete and continuous deformation during
       nanoindentation of thin films". ACTA MATERIALIA, 48 (2000): 2277‑2295.
3.   He,K., H.Gong, K.Zeng, W.L.Zheng and G.Wei, "Oxidation behaviour of stainless steel ‑ Al coatings produced by
      co‑sputtering and reactive sputtering". MATERIALS LETTERS, 46, no.11 (2000): 53‑59.

Comments