Publications‎ > ‎

International Conference Publications

1.    K.B.Yeap, K.Y.Zeng, U.Hangen, E.Zschech, "Nanoindentation for quality control of ULK films", 2011 IEEE International 
       Interconnect Technology Conference and 2011 Materials for Advanced Metallization, IIT/MAM 2011, Article No. 5940290. 
2.    Chandra Rao, B.S.S.,V.Kripesh, K.Y.Zeng, "Diffusion Kinetics and Mechanical Behavior of Lead-free Microbump Solder
       Joints in 3D Packaging Applications", 2011 Electronic Components and Technology Conference, ECTC 2011, pp.100-108.
       June 1 - 3, 2011, Lake Buena Vista, Florida, USA. 

1.    Chandra Rao, B.S.S., D.M.Fernandez, V.Kripesh, K.Y.Zeng, "Effect of solder volume on diffusion kinetics
       and mechanical properties of microbump", 2010 12th Electronic Packaging Technology Conference,
       EPTC 2010, pp.423-428. Dec 08-10, 2010, Singapore.
2.    Chandra Rao, B.S.S., K.Y. Zeng, V. Kripesh, "Determination of tensile properties of lead-free solder joints
       using nanoindentation", 2010 12th Electronic Packaging Technology Conference, EPTC 2010,
       pp.309-314. Dec 08-10, 2010, Singapore. 


1.    Chandra Rao, B.S.S., K.Mohan Kumar, K.Y.Zeng, A.A.O.Tay, and V.Kripesh, "Effect of strain rate and temperature
       on tensile flow behavior of SnAgCu nanocomposite solders", 2009 11 th Electronic Packaging Technology Conference,
       EPTC 2009, pp.272-277. Dec 09-11, 2009, Singapore. 

1.     Lim,S.H., K.Zeng, L.Chen, C.B.He and K.Wang, "Mechanical Properties of Epoxy Composite with Al2O3 Fillers".
       16th International Conference on Processing and Fabrication of Advanced Materials (PFAM XVI, 2007).
       Singapore:, 17 ‑ 19 Dec 2007).

1.    Zhang,C.Y., Y.W.Zhang, K.Zeng and L.Shen, "Studying visco‑plasticitu of amorphous polymers by indentation
       tests". Solid Mechanics and its Applications, ed. Y.L.Bai, Y.G.Wei, Q.S.Zheng.  Solid Mechanics and Its
       Applications, vol.144 (2007): 229‑238. Springer Verlar.  (IUTAM Symposium on Mechanical Behavior and
       Micromechanics of Nanostructured Materials, 27 ‑ 30 Jun 2005, Beijing, China).
2.     Zeng,K., and Y.W.Zhang, "Indentation Creep of Polymeric Materials: Experimental and Analysis".  11st
       International Conference on Fracture, ed. Alberto Carpinteri (2005). Turin: ICF11.  (11th International
       Conference on Fracture, 20 ‑ 25 Mar 2005, Turin, Italy).

1.    Sani,R.B.M., S.K.Sinha, J.P.Y.Tan and K.Zeng, "Nano‑scratching as a means to study wear debris generation in
       polymers". Proceedings of 2003 STLE/ASME Joint International Tribology Conference (2003). (2003
       STLE/ASME Joint International Tribology Conference, 26 ‑ 29 Oct 2003, United States).

1.     Chan,M.L., E.H.Tay, S.V.J.Logeeswaran, K.Zeng, L.Shen and F.S.Chau, "Experimental determination of
        micromachined discrete and continuous device spring consnat using nanoindentation method".  Proceedings of the
        SPIE Design, Test, Integration and Packaging of Mems/Moems 2002, ed. B Courtors, J.M.Karam et al.
        Proceedings of SPIE, vol. 4755 (2002): 726‑735. SPIE. (6‑ 8 May 2002, Cannes‑Mandelieu, Côte d'Azur,